The Future of ASIC Cloud Begins Here

Beyond Imagination
Unfolding the ASIC Cloud Horizon

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Powering Innovation: Pioneering Eco-Friendly Shift with an AI Accelerator-Embedded ASIC Platform for Ultra-Low Power Applications 

The Coming Revolution in AI Chip
Artemis, the Pinnacle of Hyper-Cloud ASIC Accelerators, is ingeniously crafted for superior speed in processing HPC tasks. Harnessing the power of near-threshold voltage ultra-low power and asynchronous massively parallel processing architecture, it embodies the epitome of cross-layer holistic design optimization.
Embark on an Environmental Odyssey: A Transformative Trajectory in HPC AI ASIC for Carbon Emission Reduction
Leaning into a future of superlative performance, Soteria delivers a compelling 0.275V-based standard cell re-characterization, coupled with ultra-low power analog-to-digital hybrid integration. Our trailblazing performance harvesting technologies, tiling and hardening, are impeccably optimized for the upcoming generation of immersion cooling, primed to run a myriad of AI algorithms in eco-conscious data centers. Experience the cutting-edge of super-low power with Soteria.
Device Centric Accelerator
We are at the forefront of revolutionizing data pre-processing, data augmentation, and near-data inference modeling through our device-centric accelerator. Utilizing vector extensions, we are redefining the boundaries of what’s possible in data processing, bringing about a new era of accelerated efficiency and precision.
Innovate, Integrate, Accelerate: Your HPC AI ASIC Journey Begins from Data Storage
Soteria, impeccably conceived for HPC acceleration, is the embodiment of precision engineering tailored to cater to application-specific datacenters. This innovative solution is designed to flawlessly integrate data accelerators with compute accelerators, specializing in Pipelined ML Training and Near Data Processing (NDP) – the seamless synergy for your sophisticated computing needs.
Transformed Hyper-
Scale Accelerators
for Exascale Computing

Reshaping HDL inspired hyper-scale MPPAs,

crafting practical pathways to exascale computing

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The Next

Ultra Low Power

Structure

Energy efficiency is maximized by implementing a low-power design methodology and using tidy core structures.
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SPEChpc™ HPC Benchmark
AI HPC Processing Array with Industry-Leading Performance
Similar or superior performance compared to the top tire products with lower power requirements.
Artemis, the Pinnacle of Hyper-Cloud ASIC Accelerators, is ingeniously crafted for superior speed in processing HPC tasks. Harnessing the power of near-threshold voltage ultra-low power and asynchronous massively parallel processing architecture, it embodies the epitome of cross-layer holistic design optimization.
The Next Generation.
Device Centric Accelerator
We are at the forefront of revolutionizing data pre-processing, data augmentation, and near-data inference modeling through our device-centric accelerator. Utilizing vector extensions, we are redefining the boundaries of what’s possible in data processing, bringing about a new era of accelerated efficiency and precision
Semiconductor design with the following expertise for a Customer-Centric Culture in Soteria:
Ultra Low-Power Circuit Design
Mixed Signal Designs
Third-Party IPs Integration
AI-Integrated Circuit Design
Quantum Computing Circuit Design
Thermal Dissipation-Aware Design
ESD-Aware Design
Latch-up Aware Design
Metal-Fix Strategy
Spare-Cells Strategy
Near-Data Processing Accelerator

Memory-Centric Architecture Designs

Prefetching High-Speed Interconnect Technology

Scalable Coherent Memory Access

Data Augmentation Modules

CXL-Enabled AI Accelerators

Software-Hardware Co-design

Smart Cache Accelerators

Real-Time Analytics

Dynamic Vector Extension

Our groundbreaking and forward-thinking approach is the powerhouse behind our commitment to fostering a customer-centric culture. We’re not just setting the standard, we’re redefining it, leading the industry into the future with our innovative solutions.
Our Mission
We are the purveyors of an all-inclusive, game-changing vertical solution
Our solution encapsulates data augmentation and goes beyond the mere chip, setting the gold-standard for client experience. Our dexterity in tailoring our service to align with our customers’ AI HPC infrastructure has led to the creation of groundbreaking use cases that have reshaped the landscape across diverse market sectors.

Product Portfolio
Customer Applications

Solutions

Cloud Computing
Data Center
Machine Learning

Customer Applications

Data Centers(Servers), AI Machine Learning, Cloud Computing, Edge Computing, IOT Data Centers and Cloud Computing, Database and in-memory analytics High Performance Computing (HPC) Networking and Communication Systems
Details
Transforming Green Tech with Workload-Aware Carbon-Neutral ASIC Designs
Cross-layer holistic design optimization overcoming the limit of legacy development process
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Our Clients
Silicon Valley Research Center, Development Corporation and European Partners
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We make green innovation
Meet our eco-friendly technology.
Soteria contributes towards the reduction of carbon emissions as it consumes only 35% less power than state-of-the-art HPC Accelerator.

Cutting-edge Hyper-Scale AI Acceleration
Eco-Friendly ASICs Transforming the Cloud

info@soteria-sys.com

Cutting-edge Hyper-Scale AI Acceleration
Eco-Friendly ASICs Transforming the Cloud

info@soteria-sys.com

8th Floor, JLK Tower, Yeoksam-dong 678-29, Gangnam-gu, Seoul, South Korea
1290 Reamwoo Ave., Sunnyvale, CA 94089, USA

© 2023 SOTERIA INC. All rights reserved.

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Physical Implementation Engineer

Streamlined Logical-Physical Design Fusion:

Through meticulous tiling and hardening, we adapt to application workloads, ensuring optimal grouping of Primary Processing Elements (PE) for maximum efficiency and performance.

Enhancement of Vital Operators (Addressors, Multipliers, and more):

We achieve excellence through algorithmic and gate-level enhancements, such as advanced Dynamic, Domino Design, and asynchronous operation, to sharpen performance and deliver unprecedented results.

PE Core Strengthening and Comprehensive Chip Layout:

We strive for PPAC (Power, Performance, Area, Cost) optimization, reinforcing our Primary Processing Element (PE) cores and executing a full chip layout for maximum efficiency and cost-effectiveness.

Reliable Performance Harvesting Technology:

We focus on the management of Bad Cores and defective parts (ASIC Fault) to secure dependable performance. Our advanced technology effectively handles faults in ASICs, ensuring enhanced performance and stability.

Standard Cell based Full custom layout

  • Competitive TAT for post-layout timing analysis and timing closure
  • Ensure correct timing analysis at all design specific mode and corner combinations
  • In-house flow that makes full custom layout DB apply like Auto PnR DB
  • Configure physical hierarchy
  • Schematic vs physical cell binding
  • Update components and nets
  • Extract DEF and LEF2SPEF RC extraction

- 0.3V Library Re-Characterization and Near Threshold Computation

- Dependable Low Voltage IO Design supporting Fine-grained multi-power domain

- Undershoot / Overshoot Protection Circuit

- Revolutionizing Heat Transfer Design: Experience optimal thermal dissipation through our cutting-edge Hybrid P&R Layout technology, directly integrated into the ASIC for superior microchannel and heat sink performance. We guarantee the shortest heat dissipation path from the cells at the base to the RDL at the top, maximizing surface area contact with the cooling liquid for unparalleled thermal management.

- Experience Performance Beyond Limits: With the superior cooling efficiency of our immersion cooling systems, we empower higher operational frequencies without the risk of thermal throttling, pushing the boundaries of peak performance

- Soteria’s Advance Physical Implementation

Logical/physical co-design

a. Grouping of tiling and hardening/basic processing elements (PEs) by application workload

b. Algorithm and gate-level optimization of critical operators ex) 4NM FinFET optimization Self-Shut-Off Pulsed Latches

 

c. PPAC(Power, Performance, Area, Cost) PE core enhancement and full chip layout for optimization

Optimized for customer operating environment

a. Dependable Performance Harvesting Technology – Patent Pending; Bad Core Management
b. Heat Dissipation Full Custom Layout

Immersion Cooling is a highly efficient cooling solution that involves submerging servers in a non-conductive fluid.

Soteria’s Dependable Power Protection Circuit and Bad Core Management technology, along with firmware matching, are optimized for the maintenance of our client’s eco-friendly Data Center Immersion Liquid Cooling. This cooling method allows for direct contact between components and coolant, providing exceptional heat dissipation. Immersion cooling offers a myriad of benefits including improved cooling efficiency, reduced thermal stress, performance enhancement, extended equipment lifespan, and reduced physical installation space. Furthermore, immersion cooling eliminates the need for air cooling, allows for high-density placement, and reduces noise pollution in computing environments. This stunning, top-notch technology is the epitome of our commitment to innovative solutions and environmental responsibility.
  • Quiet operation
  • Lower CAPEX and OPEX (per kW)
  • Better TCO (per kW)
  • About 10x more heat rejection capacity
  • Less space required
  • More energy efficiency and sustainability

Signal & Power Integrity Engineer

Responsibilities and Opportunities

– Chip-level & Package-level SI/PI simulations.

– Collaborate with external SI/PI service providers

Key Qualifications

– Master’s degree or higher in EE

– Deep understanding of the theory of signal transmission and electromagnetic.

– Ability to work effectively in a production environment and deliver working solutions.

– Familiarity with IBIS AMI specification, model generation and simulation in commercial EDA tools such as Hspice and ADS.

Ideal Qualifications

– Experienced in designing HPC ASIC Accelerator Chip.

Physical Implementation Engineer

Responsibilities and Opportunities

– Implement the physical design (RTL2GDS, CDL2GDS) to achieve the best PPA.

– Support DSPs and/or contractors to do their best within the target TAT.

– Suggest architectural changes to improve the final QoR.

Key Qualifications

– Bachelor’s degree in Electrical Engineering or equivalent practical experience.

– 3 years of experience with EDA tool workflows in a semiconductor environment.

– Experience in scripting (e.g., Python, Tcl, Skill) for workflow automation and data visualization.

Ideal Qualifications

– Synthesis, STA, Simulation.

– Floorplan/Power planning, P&R, PV.

– CTS.

– V-XL/MXL P&R.

– Calibre LVS/DRC, StarRC.

– EM, PERC.

Global Marketing

Responsibilities and Opportunities

– Close external technology exchange with Samsung and DSP.

– Establishment of strategies and plans related to domestic semiconductor support projects.

– Visualize and document technology development reports.

– Understand market trends and proceed with internal reflection process.

– Responding to overseas customers and managing customers.

– Marketing Performance Indicators Management.

– General Import and export business.

Key Qualifications

– Semiconductor product marketing experience.

Ideal Qualifications

– Samsung (Foundry, SLSI, Memory) Marketing Experience.

SoC Engineer

Responsibilities and Opportunities

– Co-work closely with cross-functional teams for integrating SoC.

– Co-work and communicate with DSP for SoC implementation.

– Co-work for performing silicon bring-up and debug.

Key Qualifications

– Experience on multiple core CPU sub-system.

– Experience with various peripherals such as UART, SPI, I2C, I2S, GPIO and so on.

Ideal Qualifications

– Proficiency with industry-standard EDA tools relating to SoC integration.

Front-End Design (AI ASIC design)

Position Overview

We are looking for a talented engineer with a minimum of 8 years of experience to join our Front-End Design team. This role focuses on AI Accelerator ASIC and NPU architecture design and optimization. The ideal candidate will have a strong background in RTL design, verification, and a comprehensive understanding of AI/Machine Learning algorithms.

Key Responsibilities

– Design and implementation of front-end architectures, including DC and STA.

– RTL design and verification using Verilog and VHDL.

– FPGA prototype development for AI accelerators.

– Performance analysis and power efficiency optimization.

– Integrated design and optimization of software and hardware components.

– Chip architecture design and logic verification.

– Collaboration with cross-functional teams to ensure seamless integration of designs.

– In-depth analysis and enhancement of data center and cloud computing environments.

Skills and Qualifications

Educational Background

– Bachelor’s or Master’s degree in Electrical and Electronic Engineering, Semiconductor Engineering, or a related field.

Technical Expertise

– Proficient in RTL design and verification (Verilog, VHDL).

– Skilled in FPGA prototype development.

– Expertise in performance analysis and power efficiency optimization.

– Strong understanding of AI/Machine Learning algorithms.

– Knowledge of data center and cloud computing environments.

Tools Proficiency

– Verdi, VCS, DC, PrimeTime (STA, PTPX), Formality, Spyglass.

Preferred Qualifications

– Experience in integrated software and hardware design.

– Strong problem-solving skills and ability to work in a collaborative environment.

Location

– Soteria lab in Pangyo, Republic of Korea

Front-End Design Engineer (Near Data Process design)

Position Overview

We are looking for a talented engineer with a minimum of 8 years of experience to join our Front-End Design team. The focus of this role is on Near Data Processing architecture design and optimization. The ideal candidate should have expertise in RTL design, verification, and experience with memory interface and PCIe protocol architecture

Key Responsibilities

– Design and implementation of front-end architectures, including DC and STA.

– RTL design and verification using Verilog and VHDL.

– FPGA prototype development for Near Data Processing systems.

– Design and optimization of memory interface architecture.

– Architecture design and implementation of PCIe protocol.

– Chip architecture development and logic verification.

– Collaboration with cross-functional teams to ensure effective integration of designs.

Skills and Qualifications

Educational Background

– Bachelor’s or Master’s degree in Electrical and Electronic Engineering, Semiconductor Engineering, or a related field.

Technical Expertise

– Proficient in RTL design and verification (Verilog, VHDL).

– Skilled in FPGA prototype development.

– Expertise in memory interface architecture design and optimization.

– Strong understanding of PCIe protocol architecture design and implementation.

Tools Proficiency

– Verdi, VCS, DC, PrimeTime (STA, PTPX), Formality, Spyglass.

Preferred Qualifications

– Experience in integrated software and hardware design.

– Strong analytical skills and ability to work collaboratively within a team.

Location

– Soteria lab in Pangyo, Republic of Korea

Submit Applications to HR@SOTERIA-SYS.COM