About us

Introducing Our Innovative Technology

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We Build

Future

Technology

Birthed from the cradle of innovation, the Georgia Institute of Technology, we are pioneers in energy-conscious high-performance, massively parallel computing and dependable AI ASIC Cloud systems. In collaboration with global AI Transformers, SoC conglomerates, and Eco-friendly Data Centers across Europe and North America, we are co-creating the future of technology. Our expertise lies in crafting state-of-the-art semiconductor chips and high-performance computing accelerators.

 

Embracing the slogan ‘Energy for Velocity, Potential Unlimited’, we commit to relentless innovation and technological advancements, propelling us as industry leaders.

Vision

OUR CLIENTS WANT

THEIR OWN CHIPS.

Semiconductor Technologies with Artificial Intelligence to Develop Innovative Products and Solutions
Our Value
We specialize in designing system semiconductors needed by fabless, chipless, and DSP manufacturers and companies.
We specialize in designing system semiconductors needed by fabless, chipless, and DSP manufacturers and companies. It provides various values of digital artificial intelligence hardware from systems, connected IT services, and security fields.
Innovation
Soteria believes in challenging the status quo, thinking differently, and creating groundbreaking ASIC cloud and AI accelerators that redefine performance standards
Sustainable Growth
Through Soteria eco-friendly ASIC cloud solutions, we’re not just crafting a greener future, but also sculpting a robust economic landscape where efficiency and sustainability fuel our enduring profitability.
Customer Centric
Soteria innovation is our driving force, enabling us to turn ambitious ideas into reality and deliver outstanding value to our customers, and pushing the boundaries of advanced technology to foster a customer-centric culture.
Social and Environmental Responsibility
Soteria ultra-low power ASIC Accelerator chips and NDP are at the forefront of technological innovation, driving eco-friendly, hyper-scale data centers towards a sustainable, net-zero future.
Global Cooperation
We believe in collaborating with global entities to leverage our unique capabilities, thereby creating advanced technological solutions for a sustainable future.
Passion
Through the innovation of ASIC Cloud accelerators and the massive scaling of AI accelerators, we’re not just developing hardware, we’re shaping the future of computing, and we couldn’t be more thrilled about this journey.
Leadership
Meet Our Team Members

Kim James Jongman

CEO

– Seoul National Univ. Department of E.E.
– Doctorate Degree in Pennsylvania
– Georgia Tech Professor
– Computer Architecture & AI

You Kim
CTO

– Sogang University Bachelor in Computer
– Engineering, Masters at KAIST
– Doctorate Degree in Pennsylvania
– Oak Ridge National Lab
– Sogang University Professor

Scott E. Hraster
Chief Scientist

– Georgia Tech, Ph.D.
– Firmware, System SW
– Founder and CTO of Air Defense, Acquired by Motorola

Paul Yang
Director

– KAIST, Sungkyunkwan University, Master of Electrical Engineering
– Soc Chip Design
– Samsung Electronics, Hynix 25+ Years of Experience

June Lee
Sr. Principal

– KAIST, Ph.D. in Electrical Engineering
– Intel PSG (San Jose, CA)
– Missouri University of Science&tech assistant professor
– Samsung Electronics DRAM design
– SK Hynix DRAM NAND design

Richard Sim
Director

– Chonnam national university, TJUFE MBA
– Samsung & DSP
– Technical Marketing

Junghee Lee
CSO

– Seoul National University, BS/MS Computer Engineering
– SoC Architectural Design
– Samsung Electronics
– Georgia Tech Ph.D. ECE Professor at UTSA & Korea Universoty

Victor Ahn
Director

– Sungkyunkwan University, Master of Electrical Engineering
– Physical Design
– Samsung Electronics, 22+ Years of Experience

Glory Kim
Research Fellow

– Kyungpook National University, Master of Physics
– Samsung Electronics, 28+ Years of Experience
– Device, FINFET

Global development cooperation activity
Corporate Identity
Our corporate identity stands for
Wordmark
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Clear Space
Minium Size
Digital/11px Print/4mm
Colors
Primary Palette/Wordmark Color
SOTERIA Black
RGB       0, 0, 0
CMYK    0, 0, 0, 100
SOTERIA White
RGB       246, 246, 246
CMYK    246, 246, 246
Background & Point Palette
SOTERIA Purple
RGB       92, 55, 117
CMYK    21, 53, 0, 54
SOTERIA Gray
RGB        141, 145, 161
CMYK     12, 10, 0, 37
We are always looking for talented people to join our growing team, team SOTERIA.

Cutting-edge Hyper-Scale AI Acceleration
Eco-Friendly ASICs Transforming the Cloud

info@soteria-sys.com

Cutting-edge Hyper-Scale AI Acceleration
Eco-Friendly ASICs Transforming the Cloud

info@soteria-sys.com

8th Floor, JLK Tower, Yeoksam-dong 678-29, Gangnam-gu, Seoul, South Korea
1290 Reamwoo Ave., Sunnyvale, CA 94089, USA

© 2023 SOTERIA INC. All rights reserved.

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Immersion Cooling is a highly efficient cooling solution that involves submerging servers in a non-conductive fluid.

Soteria’s Dependable Power Protection Circuit and Bad Core Management technology, along with firmware matching, are optimized for the maintenance of our client’s eco-friendly Data Center Immersion Liquid Cooling. This cooling method allows for direct contact between components and coolant, providing exceptional heat dissipation. Immersion cooling offers a myriad of benefits including improved cooling efficiency, reduced thermal stress, performance enhancement, extended equipment lifespan, and reduced physical installation space. Furthermore, immersion cooling eliminates the need for air cooling, allows for high-density placement, and reduces noise pollution in computing environments. This stunning, top-notch technology is the epitome of our commitment to innovative solutions and environmental responsibility.
  • Quiet operation
  • Lower CAPEX and OPEX (per kW)
  • Better TCO (per kW)
  • About 10x more heat rejection capacity
  • Less space required
  • More energy efficiency and sustainability

Logical/physical co-design

a. Grouping of tiling and hardening/basic processing elements (PEs) by application workload

b. Algorithm and gate-level optimization of critical operators ex) 4NM FinFET optimization Self-Shut-Off Pulsed Latches

 

c. PPAC(Power, Performance, Area, Cost) PE core enhancement and full chip layout for optimization

Optimized for customer operating environment

a. Dependable Performance Harvesting Technology – Patent Pending; Bad Core Management
b. Heat Dissipation Full Custom Layout

- 0.3V Library Re-Characterization and Near Threshold Computation

- Dependable Low Voltage IO Design supporting Fine-grained multi-power domain

- Undershoot / Overshoot Protection Circuit

- Revolutionizing Heat Transfer Design: Experience optimal thermal dissipation through our cutting-edge Hybrid P&R Layout technology, directly integrated into the ASIC for superior microchannel and heat sink performance. We guarantee the shortest heat dissipation path from the cells at the base to the RDL at the top, maximizing surface area contact with the cooling liquid for unparalleled thermal management.

- Experience Performance Beyond Limits: With the superior cooling efficiency of our immersion cooling systems, we empower higher operational frequencies without the risk of thermal throttling, pushing the boundaries of peak performance

- Soteria’s Advance Physical Implementation

Physical Implementation Engineer

Streamlined Logical-Physical Design Fusion:

Through meticulous tiling and hardening, we adapt to application workloads, ensuring optimal grouping of Primary Processing Elements (PE) for maximum efficiency and performance.

Enhancement of Vital Operators (Addressors, Multipliers, and more):

We achieve excellence through algorithmic and gate-level enhancements, such as advanced Dynamic, Domino Design, and asynchronous operation, to sharpen performance and deliver unprecedented results.

PE Core Strengthening and Comprehensive Chip Layout:

We strive for PPAC (Power, Performance, Area, Cost) optimization, reinforcing our Primary Processing Element (PE) cores and executing a full chip layout for maximum efficiency and cost-effectiveness.

Reliable Performance Harvesting Technology:

We focus on the management of Bad Cores and defective parts (ASIC Fault) to secure dependable performance. Our advanced technology effectively handles faults in ASICs, ensuring enhanced performance and stability.

Standard Cell based Full custom layout

  • Competitive TAT for post-layout timing analysis and timing closure
  • Ensure correct timing analysis at all design specific mode and corner combinations
  • In-house flow that makes full custom layout DB apply like Auto PnR DB
  • Configure physical hierarchy
  • Schematic vs physical cell binding
  • Update components and nets
  • Extract DEF and LEF2SPEF RC extraction

Signal & Power Integrity Engineer

Responsibilities and Opportunities

– Chip-level & Package-level SI/PI simulations.

– Collaborate with external SI/PI service providers

Key Qualifications

– Master’s degree or higher in EE

– Deep understanding of the theory of signal transmission and electromagnetic.

– Ability to work effectively in a production environment and deliver working solutions.

– Familiarity with IBIS AMI specification, model generation and simulation in commercial EDA tools such as Hspice and ADS.

Ideal Qualifications

– Experienced in designing HPC ASIC Accelerator Chip.

Physical Implementation Engineer

Responsibilities and Opportunities

– Implement the physical design (RTL2GDS, CDL2GDS) to achieve the best PPA.

– Support DSPs and/or contractors to do their best within the target TAT.

– Suggest architectural changes to improve the final QoR.

Key Qualifications

– Bachelor’s degree in Electrical Engineering or equivalent practical experience.

– 3 years of experience with EDA tool workflows in a semiconductor environment.

– Experience in scripting (e.g., Python, Tcl, Skill) for workflow automation and data visualization.

Ideal Qualifications

– Synthesis, STA, Simulation.

– Floorplan/Power planning, P&R, PV.

– CTS.

– V-XL/MXL P&R.

– Calibre LVS/DRC, StarRC.

– EM, PERC.

Global Marketing

Responsibilities and Opportunities

– Close external technology exchange with Samsung and DSP.

– Establishment of strategies and plans related to domestic semiconductor support projects.

– Visualize and document technology development reports.

– Understand market trends and proceed with internal reflection process.

– Responding to overseas customers and managing customers.

– Marketing Performance Indicators Management.

– General Import and export business.

Key Qualifications

– Semiconductor product marketing experience.

Ideal Qualifications

– Samsung (Foundry, SLSI, Memory) Marketing Experience.

SoC Engineer

Responsibilities and Opportunities

– Co-work closely with cross-functional teams for integrating SoC.

– Co-work and communicate with DSP for SoC implementation.

– Co-work for performing silicon bring-up and debug.

Key Qualifications

– Experience on multiple core CPU sub-system.

– Experience with various peripherals such as UART, SPI, I2C, I2S, GPIO and so on.

Ideal Qualifications

– Proficiency with industry-standard EDA tools relating to SoC integration.

Front-End Design (AI ASIC design)

Position Overview

We are looking for a talented engineer with a minimum of 8 years of experience to join our Front-End Design team. This role focuses on AI Accelerator ASIC and NPU architecture design and optimization. The ideal candidate will have a strong background in RTL design, verification, and a comprehensive understanding of AI/Machine Learning algorithms.

Key Responsibilities

– Design and implementation of front-end architectures, including DC and STA.

– RTL design and verification using Verilog and VHDL.

– FPGA prototype development for AI accelerators.

– Performance analysis and power efficiency optimization.

– Integrated design and optimization of software and hardware components.

– Chip architecture design and logic verification.

– Collaboration with cross-functional teams to ensure seamless integration of designs.

– In-depth analysis and enhancement of data center and cloud computing environments.

Skills and Qualifications

Educational Background

– Bachelor’s or Master’s degree in Electrical and Electronic Engineering, Semiconductor Engineering, or a related field.

Technical Expertise

– Proficient in RTL design and verification (Verilog, VHDL).

– Skilled in FPGA prototype development.

– Expertise in performance analysis and power efficiency optimization.

– Strong understanding of AI/Machine Learning algorithms.

– Knowledge of data center and cloud computing environments.

Tools Proficiency

– Verdi, VCS, DC, PrimeTime (STA, PTPX), Formality, Spyglass.

Preferred Qualifications

– Experience in integrated software and hardware design.

– Strong problem-solving skills and ability to work in a collaborative environment.

Location

– Soteria lab in Pangyo, Republic of Korea

Front-End Design Engineer (Near Data Process design)

Position Overview

We are looking for a talented engineer with a minimum of 8 years of experience to join our Front-End Design team. The focus of this role is on Near Data Processing architecture design and optimization. The ideal candidate should have expertise in RTL design, verification, and experience with memory interface and PCIe protocol architecture

Key Responsibilities

– Design and implementation of front-end architectures, including DC and STA.

– RTL design and verification using Verilog and VHDL.

– FPGA prototype development for Near Data Processing systems.

– Design and optimization of memory interface architecture.

– Architecture design and implementation of PCIe protocol.

– Chip architecture development and logic verification.

– Collaboration with cross-functional teams to ensure effective integration of designs.

Skills and Qualifications

Educational Background

– Bachelor’s or Master’s degree in Electrical and Electronic Engineering, Semiconductor Engineering, or a related field.

Technical Expertise

– Proficient in RTL design and verification (Verilog, VHDL).

– Skilled in FPGA prototype development.

– Expertise in memory interface architecture design and optimization.

– Strong understanding of PCIe protocol architecture design and implementation.

Tools Proficiency

– Verdi, VCS, DC, PrimeTime (STA, PTPX), Formality, Spyglass.

Preferred Qualifications

– Experience in integrated software and hardware design.

– Strong analytical skills and ability to work collaboratively within a team.

Location

– Soteria lab in Pangyo, Republic of Korea

Submit Applications to HR@SOTERIA-SYS.COM